MFP8 wire manager T568A for AWG24/1-AWG22/1, AWG27/7-AWG22/7
MFP8 wire manager T568A for AWG24/1-AWG22/1, AWG27/7-AWG22/7
Technical attributes
Article name | CU-Acc wiremgr MFP8 C6A D1-1.6 T568A |
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Remarks | AWG24/1-AWG22/1, AWG27/7-AWG22/7 |
Type | blister package (30 pcs.) |
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Description of the Series/Product Category
Notice: The following information refer to the series/product category as a whole. Please see the specific datasheet for specific technical information of a particular product.
Performance characteristics
geeignet für 10 Gigabit Ethernet 10GBASE-T gemäß IEEE 802.3
geeignet für Four Pair Power over Ethernet 4PPoE gemäß IEEE 802.3bt
Vierkammer-Adermanager mit Farbcodierung T568A
für geschirmte Verkabelungen
in 60 Sekunden und ohne Spezialwerkzeug konfektionierbar
optimiert für die Montage vor Ort
IPC-Durchdringkontakte geeignet für Massiv- und Litzenleiter
SAP Artikelbezeichnung CU-Acc wiremgr MFP8 C6A D1-1.6 T568A
Mechanical attributes
Insertion force | ≤ 30 N |
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Durability (Matings) | ≥ 750 |
Reusable contacts | ≤10 cycles |
Cu-Conductor diameter: solid | 0.51 - 0.64 mm (AWG24/1-22/1) |
Cu-Conductor diameter: stranded | 0.46 - 0.76 mm (AWG27/7-22/7) |
Mating Requirements Cu-Conductor diameter: stranded | 0.61 - 0.78 mm (AWG24-22/19) |
Core Diameter | 1,0 - 1,6 mm |
Material: contacts | phosphor bronze tinned |
Material: contact finish | Ni1,2Au0,8 |
Material: connector housing | PC UL94 V0 |
Material: PCB | FR4 UL 94 V0 |
Material: piercing contacts | phosphor bronze tinned |
Material: shield contact | brass, nickel-plated |
Material: wire pair presorting | PC UL94 V0 white |
Material: uplock hook | PBT UL94 V0 |
Material: shielding housing | zinc diecast, nickel-plated |
Material: cable clamp | PBT UL94 V0 |
Material: protection cap | PBT UL94 V0 |
Thermal and climatic attributes
Temperature range [°C] | -40/ 85 |
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UL | E244889 |
Transmission properties
10 Gigabit Ethernet acc. to IEEE 802.3an | Adequate for 10 Gigabit Ethernet |
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Norms
Connectors | IEC 60603-7-51 |
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